Hot Air Oven
Lab and industrial hot air ovens 50L–1000L+, 50–500°C. ±2°C uniformity (lab), ±5°C (industrial). J-STD-033, AMS2750, IEC 61010-1. PCB bake-out, powder coating, aerospace heat treatment.
Industrial GradeISO 9001 Certified
Vacuum Oven
Indeecon's vacuum ovens deliver precision drying, degassing, and bake-out across three performance tiers — from laboratory research (25–90L) to semiconductor production (150–250L) and heavy-duty industrial (500–1000L+). Semiconductor models meet J-STD-033 and IPC-A-610 for moisture-sensitive component handling with electropolished SS-316L chambers (under 0.01 mbar/h leak rate), inert gas purge/backfill ports, and optional direct-conduction shelf heating for ±2°C uniformity across wafer stacks.
Core Engineering Features
Precision Control
Advanced PLC architecture delivering unmatched stability and real-time parameter tracking.
Rugged Construction
Industrial-grade materials engineered for 24/7 continuous operational stress.
Custom Integration
Flexible interfaces for seamless integration with factory automation networks.
Safety Compliance
Multi-tiered fail-safes and interlocks ensuring personnel and facility protection.
Technical Data
Full Specifications
Background
What is a Vacuum Oven?
A vacuum oven removes atmospheric moisture and dissolved gases from components under controlled temperature and pressure. Critical in semiconductor packaging, PCB assembly, and battery manufacturing where even trace moisture causes failure. Unlike conventional ovens, vacuum environments enable ultra-low pressure baking (as low as 0.1 mbar) without thermal degradation—ideal for MSL (Moisture Sensitivity Level) 5–6 components and wafer-level packaging.
Compliance
Applicable Standards
Capabilities
What Makes Our Temperature and Humidity Chamber Stand Out
- Semiconductor-Grade Electropolished Chambers: SS-316L internal surfaces with under 0.01 mbar/h leak rate — critical for sub-0.1 µm feature protection and MSL 5–6 bake-out
- Precision Vacuum Control: Digital solenoid valves and Pirani/Capacitance Manometer gauges maintain steady-state vacuum ±5% over 8-hour bake cycles
- Inert Gas Purge and Backfill: Integrated N₂/Ar ports enable oxygen-free cooling and chamber normalisation after vacuum cycles
- Optional Direct-Shelf Conduction Heating: Individual shelf heaters provide ±2°C uniformity across wafer stacks — 30% faster thermal cycle vs radiant heating
- Dual-Pane Observation Window: Tempered glass and polycarbonate shield for unobstructed part visibility — Class 100 cleanroom compatible
- Modular Tool-Free Shelf Design: Rapid removal for thorough cleaning and lot reconfiguration between product batches
- Three Performance Tiers: Laboratory (1.0 mbar, 50–200°C, 25–90L); Semiconductor (0.1 mbar, 50–250°C, 150–250L); Heavy-Duty (0.5 mbar, 50–300°C, 500–1000L+)
INDUSTRIES WE SERVE
Industries That Rely on Our Hot Chamber and Cold Chamber
MSL 5–6 Component Bake-Out
Pre-reflow moisture removal for BGAs, flip-chip assemblies, and moisture-sensitive wafer packages
Semiconductor Wafer Degassing
Pre-bonding outgassing for advanced interconnect and packaging processes
PCB Assembly Dry-Packing
Post-solder moisture removal before shipping and long-term storage
Battery Cell Pre-Drying
Cathode and anode material conditioning prior to cell assembly
Pharmaceutical Processing
Solvent removal and material drying in cleanroom-compatible environments
Contract Testing
High-throughput lot processing with SPC data logging and traceability documentation
Resources & Case Studies
Related Reading
Frequently Asked Questions
Still have questions? Our engineers are happy to help.
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Hot Air Oven (Variant)
Lab and industrial hot air ovens 50L–1000L+, 50–500°C. ±2°C uniformity (lab), ±5°C (industrial). J-STD-033, AMS2750, IEC 61010-1. PCB bake-out, powder coating, aerospace heat treatment.
Laboratory Muffle Furnace
Muffle furnaces 1200°C–1800°C — Kanthal, SiC, and MoSi2 heating elements, ±3–5°C uniformity. ISO 1171, ASTM D482, AMS2750. NABL 5–9 point temperature mapping. 5L–50L volumes.